Knowledge

The bottleneck of traditional heat dissipation materials

 

No.1

The "Heat Dissipation Competition" Between Aluminum and Copper

Throughout the long history of heat dissipation materials, aluminum and copper have always been the two most prominent players. Copper, with its thermal conductivity of up to 401 W/(m・K), has long held the top spot in terms of heat dissipation performance among various materials. This outstanding thermal conductivity enables copper to quickly transfer heat away, making it an ideal choice for high-end electronic devices, precision instruments, and high-performance automotive engines where heat dissipation efficiency is of utmost importance.

 

However, copper is not without its drawbacks. Its density of 8.96 g/cm³ is quite high, which significantly increases the overall weight of devices using copper as a heat dissipation material. In applications with strict weight limitations, such as the aerospace industry, overly heavy heat dissipation components would undoubtedly increase the burden on aircraft, reducing their performance and efficiency. Moreover, copper is relatively expensive, approximately three times the cost of aluminum, making large-scale use of copper as a heat dissipation material unaffordable and severely limiting its application in cost-sensitive fields.

 

Now let's look at aluminum. With a density of only 2.7 g/cm³, about one-third that of copper, aluminum naturally has an advantage in modern industries that pursue lightweight designs. As electronic devices continue to become thinner and lighter, aluminum can effectively reduce the weight of devices, enhancing their portability and operability. Additionally, aluminum is relatively inexpensive, giving it a significant cost advantage in large-scale production and application, making it a preferred choice for many enterprises when controlling costs.

 

However, aluminum's thermal conductivity is relatively low, at only 237 W/(m・K). When dealing with the large amounts of heat generated by high-power devices, aluminum's heat dissipation capacity is somewhat inadequate. If the heat generated during device operation cannot be dissipated in a timely and effective manner, it will cause the device temperature to rise, affecting its performance and stability, and potentially shortening its lifespan.

 

It is evident that copper and aluminum each have distinct advantages and disadvantages in terms of heat dissipation performance and cost, creating a dilemma where one cannot have both "fish and bear's paw". This dilemma is becoming increasingly prominent in today's rapidly advancing technology, driving an urgent need for new heat dissipation materials. People are eager for a material that combines the high thermal conductivity of copper with the lightweight and low-cost advantages of aluminum to meet the higher requirements for heat dissipation materials in the constantly evolving industrial and technological fields.

 

No. 2 The Breakthrough of Foam Metal

Just when traditional heat dissipation materials were caught in a dilemma between performance and cost, the emergence of foam metals such as aluminum foam and copper foam was like a ray of light, bringing new hope and breakthroughs to the heat dissipation field. These new materials have successfully broken through the performance boundaries of traditional materials by constructing a unique three-dimensional porous structure in the metal matrix, thus opening a new chapter in heat dissipation materials.

Aluminum foam and copper foam have extremely high porosity, ranging from 80% to 99%, which means that there are a large number of pores evenly distributed inside them. The existence of these pores makes the material structure light, significantly reducing the weight of the material while retaining the excellent thermal conductivity of the metal matrix. It is like ingeniously carving countless tiny "ventilation tunnels" in a solid metal fortress, which not only does not affect the strength and thermal conductivity of the metal itself but also makes the entire structure lighter and more breathable.

This unique structural design also brings another important advantage - high specific surface area. Due to the internal pores, the surface area of aluminum foam and copper foam is greatly increased, increasing their contact area with the surrounding environment. When heat is transferred to the material surface, it can exchange heat with the outside world more quickly, thereby greatly improving the heat dissipation efficiency. This is like expanding a small heat sink into a huge heat dissipation network, allowing heat to be dissipated into the surrounding space more rapidly and effectively lowering the temperature of the equipment.

Through this innovation from "solid" to "porous", aluminum foam and copper foam have achieved a balance between heat dissipation efficiency and material cost. They are neither as expensive and heavy as copper nor as lacking in heat dissipation performance as aluminum. Instead, they combine the advantages of both and make up for their shortcomings, becoming the "game-changers" in the heat dissipation field. With the continuous advancement of technology and in-depth research on foam metal materials, it is believed that they will play an even more important role in the future heat dissipation field and provide a solid guarantee for the efficient operation of various high-power devices. ThermalLink

 

 

The core advantages of 2 aluminum foam / copper foam

No.1 Lightweight and High Strength

On the modern industrial stage where the pursuit of ultimate performance and lightweight is paramount, aluminum foam and copper foam have become star materials due to their astonishing lightweight and high strength properties.

Let's first look at their astonishing reduction in density. The density of aluminum foam ranges from 0.27 to 1.62 g/cm³, which means what? It is merely 10% to 60% of the density of solid aluminum, as if it has been dressed in a light "bubble coat", instantly reducing its weight. The density of copper foam is approximately 1.79 to 5.38 g/cm³, also significantly lower than solid copper, at only 20% to 60% of its density. This makes them ideal material choices in fields where weight is extremely sensitive, such as new energy vehicles and aerospace.

Take new energy vehicles as an example. The lightweight of a vehicle plays a crucial role in increasing the driving range and reducing energy consumption. Using aluminum foam to make heat dissipation components of vehicles, such as battery coolers and motor housings, not only effectively reduces the vehicle's weight but also improves heat dissipation efficiency, ensuring the battery and motor operate efficiently while extending their lifespan, thereby enhancing the vehicle's performance and competitiveness. In the aerospace field, every gram of weight reduction can bring higher flight efficiency and longer range to aircraft. The application of aluminum foam and copper foam provides strong support for the lightweight design of aerospace equipment, helping humanity explore broader cosmic spaces.

In addition to being lightweight, their specific strength is also outstanding. The porous structure of these materials, while reducing weight, achieves a remarkable 30% to 50% increase in specific strength (strength / density) over solid metals through the ingenious optimization of pore size (0.01 to 0.5 mm) and pore distribution. This means they maintain good strength while significantly reducing weight, truly achieving weight reduction without sacrificing performance. In some heat dissipation structures that need to withstand certain pressure and vibration, aluminum foam / copper foam can, with their high specific strength, not only effectively conduct heat but also provide reliable structural support for equipment, ensuring stable operation in complex working environments.

No.2 High-Efficiency Heat Dissipation

The emergence of aluminum foam and copper foam in the field of heat dissipation is largely attributed to their outstanding heat dissipation performance. Their unique three-dimensional porous structure acts like a powerful "heat dissipation engine", providing an efficient channel for the rapid dissipation of heat.

This interconnected pore structure is akin to a meticulously constructed "thermal flow highway". On one hand, through the metal framework, heat can be conducted at an extremely fast speed. The thermal conductivity of copper foam can reach 150-300 W/(m・K), and that of aluminum foam can reach 50-150 W/(m・K), far surpassing many traditional materials in terms of heat conduction performance. On the other hand, the presence of pores significantly increases the contact area between the material and air, with a specific surface area 5-10 times higher than that of solid materials. When heat reaches the pore surface, air can quickly exchange heat with it, forming a strong convective heat dissipation. Just like opening a window on a hot summer day to allow air circulation and quickly lower the indoor temperature, the pore structure of aluminum foam/copper foam accelerates the dissipation of heat to the surrounding environment, thus achieving high-efficiency heat dissipation.

In electronic devices, heat dissipation issues have always been a key factor restricting their performance improvement. Taking the heat dissipation of electronic devices as an example, copper foam fin heat sinks have demonstrated outstanding performance at 80W power. Compared with traditional aluminum fin heat sinks, their thermal resistance has been reduced by 20%-30%, meaning that heat can be conducted more smoothly, and the temperature of the device can be more effectively controlled. Moreover, copper foam fin heat sinks have stronger adaptability to wind speed. In low wind speed environments, their heat dissipation efficiency is particularly enhanced. In some electronic devices with high noise control requirements, low wind speed operation is common. At such times, copper foam fin heat sinks can fully leverage their advantages, ensuring heat dissipation effectiveness while reducing fan speed and noise generation, providing users with a quieter and more stable usage experience.

No. 3 Cost and Process

Once upon a time, new materials were often confined to small-scale applications in high-end fields due to their complex preparation processes and high costs, much like unattainable "luxury goods". However, aluminum foam and copper foam have made significant breakthroughs in terms of cost and process, gradually transforming from lofty "luxury goods" to promising "commodities" with wide application potential.

In terms of material cost, although copper foam is more expensive than aluminum foam, it still reduces costs by 30% to 50% compared to solid copper. This makes copper foam a more cost-effective choice in fields where there are certain cost constraints but high requirements for heat dissipation performance. The cost advantage of aluminum foam is even more pronounced, being only 1/5 to 1/3 of solid copper. In large-scale applications, it can save enterprises a significant amount of material costs. For small and medium-sized enterprises that pursue low costs and high efficiency, aluminum foam is undoubtedly the preferred choice for heat dissipation materials. It not only meets the enterprises' requirements for product heat dissipation performance but also provides strong support in cost control.

In terms of preparation process, technological advancements have brought new opportunities for the development of aluminum foam and copper foam. Through advanced techniques such as melt foaming (for aluminum foam) and electroplating (for copper foam), people can precisely control the porosity and pore size of the materials to meet the needs of different heat dissipation scenarios. In the heat dissipation of electronic devices, the pore structure of aluminum foam/copper foam can be precisely adjusted according to the heat generation power of the chip and space limitations to achieve the best heat dissipation effect. These preparation processes also have the advantage of batch production, which can meet the demands of large-scale industrial production and promote the wide application of aluminum foam and copper foam in various fields. As production scales expand, costs will further decrease, laying a solid foundation for their wider application in more fields. ThermalLink

 

 

Empowerment through Diverse Scenarios 3

No.1 Electronic Information Field

In the field of electronic information, with the rapid development of technology, the integration of equipment is getting higher and higher, and the power density has also increased significantly. This makes heat dissipation a key factor restricting the performance and reliability of the equipment. Foam aluminum and foam copper, with their excellent heat dissipation performance and lightweight characteristics, play a significant role in this field and have become powerful weapons to address the challenges of high-density heat generation.

In 5G base stations, a large amount of signal processing and data transmission generate a huge amount of heat. The power density of 5G base stations is several times that of 4G base stations, and traditional heat dissipation materials and technologies are difficult to meet their heat dissipation requirements. The emergence of foam copper heat sinks provides an effective solution to this problem. Foam copper heat sinks have high thermal conductivity and high specific surface area, which can quickly transfer the heat generated by the chips and, in combination with heat pipe structures, efficiently dissipate the heat into the surrounding environment. In practical applications, a certain 5G base station adopted a heat dissipation solution combining foam copper heat sinks and heat pipes, successfully keeping the junction temperature of the chips within a safe range, ensuring the stable operation of the equipment and significantly improving the communication quality and reliability of the base station.

In the consumer electronics field, devices such as laptops and mobile phones, while pursuing high performance, also have higher requirements for lightness and portability. The application of foam aluminum heat dissipation modules well meets this demand. Compared with traditional copper heat dissipation solutions, the weight of foam aluminum heat dissipation modules is reduced by 40%, which reduces the overall weight of laptops and mobile phones and improves their portability. Moreover, foam aluminum heat dissipation modules also have good heat dissipation performance and can meet the heat dissipation requirements of ultra-thin bodies. In a certain ultra-thin laptop, foam aluminum heat dissipation modules were used to achieve efficient heat dissipation within a limited space, ensuring the temperature stability of the processor under high-load operation and enhancing the user experience.

No.2 New Energy Vehicles

As an important direction for future transportation development, the performance and safety of the "three electric" systems (battery, motor, and electronic control) of new energy vehicles directly affect the overall performance and reliability of the vehicle. Foam aluminum and foam copper play a crucial role in heat dissipation in the "three electric" systems of new energy vehicles, ensuring their safe and efficient operation.

In the battery pack, a large amount of heat is generated during the charging and discharging process. If this heat cannot be dissipated in a timely and effective manner, it will cause the battery temperature to rise excessively, affecting the battery's performance and lifespan, and even leading to safety accidents. Foam aluminum thermal pads have excellent thermal conductivity and flexibility, allowing them to closely adhere to the surface of the battery cells and evenly conduct the heat generated by the cells. Combined with a liquid cooling system, foam aluminum thermal pads can keep the temperature difference within the battery pack within ±2°C, effectively preventing local overheating. A certain new energy vehicle brand has adopted a thermal management solution combining foam aluminum thermal pads and a liquid cooling system in its battery pack. Through actual testing, this solution has significantly improved the charging and discharging efficiency and cycle life of the battery, while enhancing its safety and reducing the risk of thermal runaway.

For the drive motor and electronic control system, foam copper heat sinks also perform exceptionally well. The drive motor generates a large amount of heat during operation and requires timely heat dissipation to ensure its efficient and stable operation. Foam copper heat sinks have high thermal conductivity and a compact structure, enabling efficient heat dissipation in a limited space. In a certain electric vehicle, the drive motor equipped with a foam copper heat sink maintained an effective temperature control during continuous operation in high-temperature conditions, increasing the power density and thereby enhancing the vehicle's range and power performance. As the "brain" of new energy vehicles, the electronic control system also has strict requirements for heat dissipation. Foam copper heat sinks can quickly dissipate the heat within the electronic control system, ensuring that electronic components operate within a normal temperature range, improving the reliability and stability of the electronic control system.

 

No.3 Industry and Aerospace

In the fields of industry and aerospace, equipment often needs to operate in extreme environments, such as high temperatures, high pressures, high radiation, and extreme temperature differences. Foam aluminum and foam copper, with their excellent heat dissipation performance, high-temperature resistance, and lightweight characteristics, have become the go-to materials for heat dissipation in these extreme conditions.

In industrial equipment, high-power lasers and power electronic devices generate a large amount of heat during operation, and the working environment temperature is relatively high, imposing extremely strict requirements on the performance of heat dissipation materials. Foam metal heat dissipation modules can withstand high-temperature environments of 200-300°C and have better corrosion resistance than traditional materials. In a certain high-power laser, a foam aluminum heat dissipation module was adopted, effectively solving the heat dissipation problem during the laser's long-term operation and ensuring the stability of laser output and beam quality. In power electronic devices, foam copper heat dissipation modules can quickly dissipate the heat generated by power components, improving the efficiency and reliability of the device and reducing the occurrence of faults due to overheating.